Posted

30+ days ago

Description

The Process Engineer is responsible Providing PVD/Electroplating expertise to RP design/Process teams and Partner fabs to improve cycle time, yield and quality of metallization/bonding processes for RP products.

MAJOR RESPONSIBILITIES

*This list is not all inclusive. Additional duties will be assigned as needed.

  • Own the entire metallization and solder bump process modules across the RP product line with the aim of:
  • Working with RP Process Development and packaging teams to drive understanding of the upstream and downstream integration requirements and process specification parameters to allow development of modules with healthy Cp/Cpks
  • Analyzing and evaluating specification versus performance to ensure the optimal match of requirements with production equipment capability to obtain high yield, good process capability and low cycle time.
  • Determining the approach used for these modules, including the materials and process technologies used (e.g. evaporation, PVD, electroplating), with emphasis on yield, cycle time and wafer cost
    • Work with partner fabs to develop associated processes, through disciplined use of statistical methods (SPC, DOE etc), to ensure the modules have robust process controls and healthy process capabilities
    • Documenting the results of any experiments to allow sharing of best practice across all RP product lines for backend metallization
  • Keep abreast of the latest PVD and Solder Bump formation processes/equipment applicable to RP products to provide potential solutions to metallization and bonding issues. Where appropriate work with backend equipment/material suppliers and partner fabs to organize demonstrations of these potential solutions. Define and assess the related success criteria of these demonstrations to allow correct selection of materials/equipment/processes should they be required to solve a backend metallization/bonding issue.
  • Provide backend process expertise (PVD, Electroplating) to drive rapid continuous improvement of quality, yield, cost and process stability/capability
  • Play a key role in Quality Clinic problem solving teams developing solutions using backend processing experience, statistical knowledge and problem-solving techniques. Help develop robust strategies to prevent issue recurring in the future.
  • Work with Partner fabs to define and implement appropriate PCM structures and, where necessary, process stabilization features (e.g. dummification) to reduce mask to mask and run to run variability. PCM structures should allow SPC monitoring of RP backend processes and accurately reflect critical circuit features/performance requirements.
  • Maintain log of partner fab PVD/Solder Bump capabilities with the aim of:
    • Providing input to the RP Process Development, Packaging and Design Teams on what is achievable with current tool set – design for capability where possible
    • Determine any PVD/Solder Bump process capability gaps for RP products
    • Define proposed solutions to close these capability gaps e.g. process change, outsource step to different partner fab and CapEx investments in equipment
  • Rigorous use of statistics for experimental design (DOE) and process control (SPC) to allow data driven decisions to be made
  • Own pFMEA for all metallization and solder backend processes to drive quality improvements

EDUCATION & EXPERIENCE

  • Bachelor’s degree required, Master’s degree preferred, in related fields of Electrical Engineering, Chemical Engineering, Materials Science or Applied Physics
  • 5+ of related experience in process manufacturing or as Process Development Engineer in a MEMS, semiconductor, or other relevant production fab environment
  • Extensive knowledge of metallurgy, such as compatible metal systems, appropriate adhesion and diffusion barriers, phase diagrams, failure modes etc.
  • Ability to demonstrate a balanced and in-depth understanding of both the process physics and/or chemistry required to achieve a highly stable and predictive backend metallization/solder bump process.
  • Demonstrated experience of setting up and sustaining PVD/Electrochemistry equipment, processes, and various metrology methods associated with the control and monitor of such processes
  • Demonstrate a disciplined use of statistical methods to establish robust process controls and healthy process capabilities, analyze process yield, and perform experimental design and analysis. Experience of design of experiments and statistical methods is essential.Demonstrate good knowledge of formal problem-solving techniques and a proven track record in developing strategies to prevent problems for recurring in the future.
  • Experience of defect reduction within backend metallization/solder bump processes and failure analysis techniques

“This position requires access to information protected under US export control laws, including the International Traffic in Arms Regulations and/or the Export Administration Regulations.  Please note that any offer of employment may be conditioned on authorization to receive software or technology controlled under these US export laws without sponsorship for an export license.”